silvaco代码笔记(1)ATHENA定义工艺步骤
go athena
Non-unifrom Grid
line x loc=0.00 spac=0.10 line x loc=0.20 spac=0.010 line x loc=0.60 spac=0.010
line y loc=0.00 spac=0.008 line y loc=0.20 spac=0.01 line y loc=0.50 spac=0.05 line y loc=0.8 spac=0.15
定义衬底
init silicon c.boron=1.0e14 orientation=100 two.d
生成氧化层
diffus time=30 minutes temp=1000 dryo2 press=1 hcl.pc=3
extract name=“Oxidethick” thickness material=“SiO~2” mat.occno=1 x.val=0.3
沉淀多晶硅层
deposit polysilicon thick=0.2 divisions=10
离子注入
implant arsenic dose=1.0e15 energy=40 tilt=7 rotation=30 crystal
退火
method fermi diffus time=2 minutes temp=1000 nitro press=1
extract name=“Oxidethick” sheet.res material=“Polysilicon” mat.occno=1 x.val=0.3 region.occno=1 semi.poly
刻蚀
etch oxide left p1.x=0.15
刻蚀
etch oxide right p1.x=0.45
氧化多晶硅
method fermi compress diffus time=3 minutes temp=900 weto2 press=1
刻蚀电极接触孔
etch oxide start x=0.25 y=-0.25 etch cont x=0.35 y=-0.25 etch cont x=0.35 y=-0.20 etch done x=0.25 y=-0.20
沉淀多晶硅层
deposit aluminum thick=0.05 divisions=10
刻蚀电极接触孔
etch aluminum left p1.x=0.2
刻蚀电极接触孔
etch aluminum right p1.x=0.4
输出结构
structure outfile=SheetRegister.str
tonyplot
quit
